首页> 外文会议>Electron Devices Meeting (IEDM), 2009 >A stacked SONOS technology, up to 4 levels and 6nm crystalline nanowires, with Gate-All-Around or independent gates (Φ-Flash), suitable for full 3D integration
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A stacked SONOS technology, up to 4 levels and 6nm crystalline nanowires, with Gate-All-Around or independent gates (Φ-Flash), suitable for full 3D integration

机译:堆叠式SONOS技术,多达4层和6nm晶体纳米线,具有全能门或独立门(Φ-Flash),适用于全3D集成

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We present the first experimental study of a Gate-All-Around (GAA) SONOS memory architecture with 4-level crystalline nanowire channels (down to 6 nm-diameter). The technology is also extended to an independent double gate memory architecture, called :6;-Flash. The experimental results with 6 nm nanowires show high programming windows (up to 7.4 V), making the structure compatible with multilevel operation. Excellent retention even after 104 cycles is achieved. The independent double gate option has otherwise been successfully integrated with 4-level stacked nanowires for multibit applications. The :6;-Flash exhibits up to 1.8 V 94;VTh between its two gates, demonstrating multibits operation. The basic process to fully disconnect the different nanowires in view of a full 3D integration of a memory array is discussed.
机译:我们介绍了具有4级结晶纳米线通道(低至6nm-直径)的门 - 全部(GaA)Sonos内存架构的第一个实验研究。该技术还扩展到独立的双栅极内存架构,称为:6; -FLASH。 6 NM纳米线的实验结果显示出高编程窗口(高达7.4 V),使结构与多级操作兼容。即使在10 4 循环之后,均匀的保留也是优异的保留。否则,独立的双栅极选项已经成功集成了4级堆叠纳米线,用于多BiBIT应用。答:6; -FLASH展示高达1.8 V 94; V TH 在其两个门之间,演示了多合操作。讨论了鉴于完全3D集成存储器阵列的完全纳米线的基本过程。

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