This work demonstrates, for the first time, the reduction of random telegraph noise (RTN) in high-;A;/metal gate (HK/MG) stacks incorporated in 22 nm generation FETs. Many thousands of such FETs have been fabricated, measured, and analyzed using a statistical technique to separate RTN as a major noise component from 1/f noise as a minor component. Based on a statistical comparison of these FETs, we find that high temperature forming gas annealing can suppress RTN threshold voltage variation (94;Vth). In addition, properly annealed HK FETs have smaller RTN 94;Vth than SiON FETs, due mostly to fewer traps and partly to thinner inversion thickness in HK/MG. Based on these results, we project that random dopant fluctuations will have a greater impact on SRAM yield than RTN until at least the 15 nm generation, for doped channel FETs.
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机译:这项工作首次证明了减少集成在22纳米FET中的高; A; /金属栅极(HK / MG)堆叠中的随机电报噪声(RTN)。已经使用统计技术制造,测量和分析了成千上万个此类FET,以将作为主要噪声成分的RTN与作为次要成分的1 / f噪声分开。通过对这些FET的统计比较,我们发现高温形成气体退火可以抑制RTN阈值电压变化(94; V th sub>)。此外,经过适当退火的HK FET的RTN 94; V 比SiON FET小,这主要是由于HK / MG中的陷阱更少,部分是由于反转厚度较薄。根据这些结果,我们预测,对于掺杂沟道FET,直到至少15 nm世代为止,随机掺杂物的波动都会比RTN对SRAM良率产生更大的影响。
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