首页> 外文会议>Electron Devices Meeting, 2001. IEDM Technical Digest. International >Highly stable SOI technology to suppress floating body effect for high performance CMOS device
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Highly stable SOI technology to suppress floating body effect for high performance CMOS device

机译:高度稳定的SOI技术可抑制高性能CMOS器件的浮体效应

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High performance microprocessors with high stabilities are fabricated on Si and SiGe inserted (SGI) SOI wafers. The operation margins of voltages and frequency are characterized. For body floating devices, the operation margins at high Vdd and low frequency are narrow due to the floating body effect (FBE). These operation limits are drastically improved by applying a body contact for only NMOS at the critical circuits sensitive to the FBE. The maximum operation voltage increases from 1.8 V up to 2.5 V. The minimum operation frequency is lowered from 370 MHz to 220 MHz. The functionality of the NMOS body contact SOI microprocessor is comparable to that of the bulk. To maximize the SOI performance gain, body contacted and floating SOI devices should be optimized, and the smaller portion of body contacted devices are conclusive. For body floating SOI devices, the SGI SOI technology is very effective in suppressing SOI FBE and provides stable circuit operation.
机译:具有高稳定性的高性能微处理器是在Si和SiGe插入(SGI)SOI晶圆上制造的。表征电压和频率的工作裕度。对于浮体器件,由于浮体效应(FBE),高Vdd和低频处的工作裕度很窄。通过仅在对FBE敏感的关键电路上为NMOS施加人体接触,可以大大改善这些工作极限。最大工作电压从1.8 V增加到2.5V。最小工作频率从370 MHz降低到220 MHz。 NMOS体接触式SOI微处理器的功能可与大部分功能相媲美。为了最大程度地提高SOI性能,应优化与身体接触的和浮动的SOI器件,而与身体接触的器件的较小部分是决定性的。对于体浮式SOI器件,SGI SOI技术在抑制SOI FBE方面非常有效,并提供稳定的电路操作。

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