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Ultra-Smoothness Grinding of Fine Ceramics with #140-Mesh Grain Size Diamond Wheel

机译:#140粒度金刚石砂轮对超细陶瓷的超光滑研磨

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The ductile-mode grinding of fine ceramics of the hot pressed silicon carbide (HPSC), the hot isostatic pressed silicon nitride (HIPSN) and the alumina-titanium carbide (Al_2O_3-TiC) with the coarse #140-mesh metal-bonded diamond wheel is found to be possible in the surface plunge grinding. The surface roughness in the ductile-mode plunge grinding, however, is rough over 200nm(Rmax) because of the formation of the grinding grooves. The newly devised ultra-smoothness grinding method in which the grinding grooves can be removed and diminished is effective for the formation of ultra-smoothness surface on the fine ceramics. When using the new method, the surface roughness of the ground hot pressed silicon carbide ceramic area of 50μm square measured with AFM is attainable about 3.8nm(Rmax) and 0.9lnm(RMS).
机译:带有#140粗金属结合金刚石砂轮的热压碳化硅(HPSC),热等静压氮化硅(HIPSN)和氧化铝-碳化钛(Al_2O_3-TiC)精细陶瓷的延性磨削被发现在表面切入磨削中是可能的。但是,由于形成了磨削槽,因此在延性模切磨削中的表面粗糙度超过200nm(Rmax)时比较粗糙。新设计的超光滑磨削方法可以去除并减少磨削凹槽,这种方法对于在精细陶瓷上形成超光滑表面非常有效。当使用新方法时,用AFM测得的50μm见方的经热压的碳化硅陶瓷陶瓷表面的表面粗糙度可达到约3.8nm(Rmax)和0.9lnm(RMS)。

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