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Analysis of Electrical Performance of 1200V/200A Full SiC Power Module

机译:1200V / 200A全SiC电源模块的电气性能分析

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Silicon carbide (SiC) module with high power, high frequency, large current characteristics, has received extensive attention in the new energy vehicles, the new energy power generation, the smart grid and other fields.Electrical characteristics of the 1200V/200A SiC module are analyzed by the finite element simulation method in this paper. Based on the simulation results, a low-inductance and high-reliability SiC module is developed. The parasitic inductance of SiC module is 18.846nH, and the threshold voltage (Vth) is 2.0V, and the change is less than 0.1v before and after aging test. The high temperature gate bias test (HTGB) and high temperature reverse bias test (HTGB) have verified that SiC module still has good stability after a long-time experiment at 150°C and 175°C. After the HTGB, the gate leakage current of SiC module is still below 400nA, and the power consumption increases little. Moreover, after the HTRB, the leakage current of SiC module shows excellent stability, which proves that the SiC module can work at high voltage and high temperature.
机译:具有高功率,高频率,大电流特性的碳化硅(SiC)模块已在新能源汽车,新能源发电,智能电网等领域受到广泛关注.1200V / 200A SiC模块的电气特性为本文通过有限元模拟方法进行了分析。基于仿真结果,开发了一种低电感,高可靠性的SiC模块。 SiC模块的寄生电感为18.846nH,阈值电压(Vth)为2.0V,老化前后的变化小于0.1v。高温栅极偏置测试(HTGB)和高温反向偏置测试(HTGB)已验证SiC模块在150°C和175°C的长时间实验后仍具有良好的稳定性。 HTGB之后,SiC模块的栅极泄漏电流仍低于400nA,功耗几乎没有增加。而且,经过HTRB之后,SiC模块的漏电流表现出优异的稳定性,这证明SiC模块可以在高压和高温下工作。

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