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Metal Gate Work Function Engineering: Sub-Nano Regime Double Gate MOSFETs

机译:金属栅极功函数工程:亚纳米级双栅极MOSFET

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The effect of metal gate (MG) work function (WF) on MOSFETs having double gate has been researched for the next generation logic applications. GaN-based Double-Gate MOSFETs, by tuning the value of work functions (WF) are investigated by simulation to establish the transport characteristics to mitigate SCEs (short channel effects). The metal gate (MG) work functions (WF) is varied between 3.5 eV and 4.8 eV and the device performance is evaluated. The reduction of SCEs is observed for multiple metal gate (MG) work functions (WF). The simulation results apprise that by tuning the work function of GaN-based double-gate MOSFETs, the threshold voltage tuning can be possible. The reduction of short channel effects (SCEs) can be possible by fixing the congenial value of the threshold voltage (VT). The simulations have been performed for GaN-based DG-MOSFETs considering 9.7 nm (ITRS- Year: 2021) length of the gate (LG). The device turn on and turn off voltage (Gate-Source) is respectively, VGS =1 V and VGS= 0 V. The effective oxide thickness (EOT) is considered as 0.56 nm for a gate length of 9.7 nm. In the device simulation focus has been set on VTH, ION, IOFF, DIBL and SS, this metrics has been done for multiple metal gate work functions. The value of drain induced barrier lowering (DIBL) and subthreshold leakage current is reduced and threshold voltage (VT) is increased with tuning the metal gate work functions. The proposed GaN-based DG-MOSFETs suggests that the reduction of short channel effects (SCEs) can be possible by tuning the MG-WF (metal gate-work function).
机译:已经针对下一代逻辑应用研究了金属栅极(MG)功函数(WF)对具有双栅极的MOSFET的影响。基于GaN的双栅MOSFET通过模拟功函数(WF)的值进行了仿真研究,以建立传输特性以减轻SCE(短沟道效应)。金属门(MG)的功函数(WF)在3.5 eV和4.8 eV之间变化,并评估了器件性能。对于多个金属栅极(MG)功函数(WF),观察到SCE的减少。仿真结果表明,通过调整GaN基双栅MOSFET的功函数,可以进行阈值电压调整。通过固定阈值电压(VT)的合适值,可以减小短沟道效应(SCE)。考虑到栅极(L)的长度为9.7 nm(ITRS- Year:2021),对基于GaN的DG-MOSFET进行了仿真 G )。器件的开启和关闭电压(栅极-源极)分别为V GS = 1 V和V GS = 0V。对于9.7 nm的栅极长度,有效氧化物厚度(EOT)被认为是0.56 nm。在器件仿真中,重点放在了V TH ,ION,我 关闭 ,DIBL和SS,此指标已针对多个金属栅极功函数完成。随着金属栅极功函数的调整,漏极引起的势垒降低(DIBL)和亚阈值泄漏电流的值减小,阈值电压(VT)增大。所提出的基于GaN的DG-MOSFET建议通过调节MG-WF(金属栅极功函数)来减少短沟道效应(SCE)。

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