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Study on an Improved Wafer Level Fabrication Process to Achieve Size Uniformity for Micro Glass Shell Resonators

机译:改进的晶圆级制造工艺以实现微玻璃壳谐振器尺寸均匀性的研究

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The size of the 3D micro glass shell resonator is one of the main factors affecting the performance of the micro shell resonator gyroscopes (μSRG) such as resonant frequency and quality factor. Different sizes result in different resonant frequencies, which will directly affect the performance of the μSRG. Therefore, for wafer-level fabrication process of micro shell resonators, ensuring size uniformity is an important issue that must be considered. The original wafer-level method for the preparation of micro shell resonators - chemical foaming process (CFP), cannot guarantee that all the resonators on the wafer have the same size. In this paper, an improved process is investigated to improve size uniformity of wafer level shell resonators. Through the measurement, the standard deviation of the height of micro shell resonators on the wafer is reduced from 0.12 to 0.08, and the range is reduced from 480 μm to 350 μm. The improved process shows potential for improving size uniformity.
机译:3D微玻璃壳谐振器的尺寸是影响微壳谐振器陀螺仪(μSRG)性能的主要因素之一,例如谐振频率和品质因数。不同的尺寸会导致不同的谐振频率,这将直接影响μSRG的性能。因此,对于微壳谐振器的晶圆级制造工艺,确保尺寸均匀性是必须考虑的重要问题。制备微壳谐振器的原始晶圆级方法-化学发泡工艺(CFP)无法保证晶圆上的所有谐振器都具有相同的尺寸。在本文中,研究了一种改进的工艺以改善晶片级壳谐振器的尺寸均匀性。通过测量,晶片上的微壳谐振器的高度的标准偏差从0.12减小到0.08,并且范围从480μm减小到350μm。改进的工艺显示出改善尺寸均匀性的潜力。

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