The Development of High Thermal Dissipation Intelligent Power Module Packaging Technology

摘要

The paper introduces a 600V/30A intelligent power module packaging structure which uses the thermal interface material (TIM) to be the insulation layer. This layer has the high thermal dissipation capability that helps to transfer the heat generated from power chips. The IPM are utilized for home applications such as air-conditioning, refrigerators, and washing machines etc. By fast switching the power chips to control the motor drive and save the energy. Compared to conventional direct bonded copper (DBC) type IPM, the developed IPM has the lighter packaging structure, simple fabrication process, and lower thermal conduction path that means a good performance will show up when using it for motor drive. Moreover, the TIM type IPM has passed the long term reliability test including thermal cycling test (TCT), highly-accelerated temperature and humidity stress test (HAST), and high temperature storage test (HTS).