首页> 外文会议>IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems >Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf
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Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf

机译:使用低GWP R1234ZE和R1234YF的完全被动单和再循环环热旋流式冷却系统的实验性能和R1234YF

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This paper proposes a novel concept for a loop thermosyphon cooling system, designed for the transistor module of a transformer. The thermosyphon uses a free convection cooled condenser, making the system completely passive, i.e. no energy consumption is needed for it to function. Furthermore, the novel configuration uses the separation of the liquid and vapor phases at the evaporator outlet in such a way that the liquid is recirculated at the evaporator inlet while the vapor goes up in the riser. The frictional pressure drops in the riser and the condenser are thus reduced, and the overall gravitational force on the working fluid is increased, leading to an increase in the mass flow rates. Two low-GWP working fluids are tested in both the single and recirculation loops: R1234ze and R1234yf. The comparison between the two loop configurations is carried out discussing the temperature readings of the heaters used to emulate the transistors, the overall thermal resistance and the mass flow rates. It is demonstrated that the recirculation loop is a desirable solution for low-pressure working fluids, such as the R1234ze, because of the higher reduction of the liquid phase in the riser. For high-pressure fluids, such as the R1234yf, the improvements regarding mass flow rates are minor, but still present. At the maximum heat load tested for each configuration (65 - 70 W), the overall thermal resistance is within the range 0.44 - 0.48 K/W, and the temperature of the heaters is always lower than 55 °C. According to these data, the thermosyphon system proposed here seems to be an optimal solution for the cooling of high-heat flux electronic devices.
机译:本文提出了一种用于环形热旋流式冷却系统的新颖概念,专为变压器的晶体管模块而设计。热水烃采用自由对流冷却冷凝器,使系统完全被动,即它不需要能量消耗。此外,新颖的配置使用液体和蒸汽相在蒸发器出口处的分离,使得液体在蒸发器入口处再循环,而蒸汽在提升管中升高。因此降低了提升管和冷凝器中的摩擦压力,并且工作流体上的总重力增加,导致质量流量增加。两个低GWP工作流体在单一和再循环环中进行测试:R1234ze和R1234YF。进行两个环路配置之间的比较,讨论用于模拟晶体管的加热器的温度读数,整体热阻和质量流量。结果证明,再循环回路是低压工作流体的理想溶液,例如R1234中,因为提升管中的液相较低。对于高压流体,例如R1234YF,关于质量流量率的改进是轻微的,但仍然存在。在对每个配置(65-70W)测试的最大热负荷下,总热阻在0.44-0.48k / w的范围内,加热器的温度总是低于55℃。根据这些数据,这里提出的热循环系统似乎是用于冷却高热通量电子设备的最佳解决方案。

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