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Optimization of floating guard ring parameters in separate-absorption-and-multiplication silicon avalanche photodiode structure

机译:分离吸收倍增硅雪崩光电二极管结构中浮动保护环参数的优化

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In this paper, the effect of the floating guard ring (FGR) parameters, such as number of FGRs and the distances between the FGRs, on the prevention of the breakdown at the multiplication layer edge for a given avalanche photodiode (APD) structure has been analyzed. Four structures are examined: APD without FGR and APDs with one, two and three FGRs. The width and depth of the boron-doped FGRs is 1 μm with peak concentration of 1018 cm. The intrinsic breakdown voltage in the active region of the APD is 371 V and the epitaxial layer is fully depleted at 14 V. The breakdown occurs in the active area of the APD structure by using three FGRs. The optimal position of three FGRs are determined and the breakdown voltage of 409 V is achieved at the multiplication edge, which is higher by 38 V than in the active region. In contrast, the edge breakdown voltage is 170 V, 270 V and 348 V for structures without floating guard rings, with one FGR and with two FGRs, respectively. Spectral responsivity of the structure is analyzed in the range of 400 to 1000 nm showing that such APD can be effectively used for detection of the visible light.
机译:在本文中,对于给定的雪崩光电二极管(APD)结构而言,浮动保护环(FGR)参数(例如FGR的数量和FGR之间的距离)对防止倍增层边缘击穿的影响已得到证实。分析。检查了四个结构:没有FGR的APD和带有一个,两个和三个FGR的APD。硼掺杂的FGR的宽度和深度为1μm,峰值浓度为1018 cm。 APD有源区的本征击穿电压为371 V,外延层在14 V时完全耗尽。通过使用三个FGR在APD结构的有源区中发生击穿。确定了三个FGR的最佳位置,并在倍增边缘实现了409 V的击穿电压,该电压比有源区域高38V。相反,对于不具有浮动保护环,分别具有一个FGR和具有两个FGR的结构,其边缘击穿电压为170 V,270 V和348V。在400至1000nm的范围内分析该结构的光谱响应度,表明这种APD可有效地用于可见光的检测。

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