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Material engineering in Cylindrical Surrounding Double Gate (CSDG) MOSFETs for enhanced electrostatic integrity and RF performance

机译:圆柱形环绕双栅(CSDG)MOSFET的材料工程设计可增强静电完整性和RF性能

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This paper investigates influence of material engineering on the performance parameter of (Cylindrical Surrounding Double Gate) CSDG MOSFET for improvement in performance. CSDG MOSFETs are evaluated for various parameters such as surface potential, electric field, drain on current, off current, transconductance, cut-off frequency and total gate input capacitance. The comparison of the gate material engineering on CSDG MOSFET has been done on the normal CSDG MOSFET incorporating dual materials at gate electrode, using the ATLAS 3D device simulator. The result shows that, with incorporation of dual materials on the gate electrode, the device performance parameter improves by shifting the higher electric field and minimum surface potential more towards the source side than in the normal CSDG MOSFET.
机译:本文研究了材料工程对(圆柱环绕双栅)CSDG MOSFET性能参数的影响,以提高性能。对CSDG MOSFET的各种参数进行了评估,例如表面电势,电场,漏极导通电流,截止电流,跨导,截止频率和总栅极输入电容。 CSDG MOSFET的栅极材料工程设计的比较是使用ATLAS 3D器件仿真器在栅电极上结合了双材料的普通CSDG MOSFET上完成的。结果表明,与普通CSDG MOSFET相比,通过在栅电极上掺入双材料,器件性能参数通过将较高的电场和最小表面电势更多地移向源极侧而得到改善。

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