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Tin plating investigation as a potential alternate to silver plating in plug in connection for low voltage low amp miniature circuit breakers

机译:镀锡作为低压低压放大器微型断路器的插头中镀银的潜在交替。

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This paper reports the investigation of tin plating as a potential alternate to silver plating on plug in line terminal connections for low voltage low amp miniature circuit breakers. The plug in line terminals are typically connected on the enclosure interior bus bars and clamped with a spring clip. The substrate material of the line terminal was a copper alloy. The line terminals with both, tin and silver plating, were investigated on tin plated aluminum and bare copper bus bars. The connections were examined by cycling 50 Amps ac, one hour on and one hour off for 2,100 cycles in an ambient temperature of 25°C. The examined parameters were bulk temperature and voltage drop. SEM observations have been made for both, tin and silver plating, after the current cycling. Additionally, the plating deterioration on the contact spots was measured for oxygen and copper contents by EDX analysis. The analysis results indicated much higher contents of oxygen and copper on the tin plated connectors than the silver plated connectors which is consistent with the connector plating deterioration and fretting that was observed with the SEM.
机译:本文报道了对低压低压电压微型断路器的插头端子连接上的镀银电镀作为镀银的潜在交替的调查。线端子中的插头通常连接在外壳内部汇流条上并用弹簧夹夹紧。线末端的基材材料是铜合金。在镀铝铝和裸铜母线上研究了锡和镀银的线路端子。通过在25℃的环境温度下循环50AMPS AC,1小时左右休息2,100个循环,通过循环50AMPS AC,1小时休息。检查的参数是体积温度和电压降。在电流循环后,已经为锡和镀银进行了SEM观察。另外,通过EDX分析测量氧气和铜内容物的电镀劣化。分析结果表明镀锡连接器上的氧气和铜的含量远远大于镀银连接器,该镀银连接器与用SEM观察到的连接器电镀劣化和微动机一致。

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