首页> 外文会议>Annual SEMI Advanced Semiconductor Manufacturing Conference >450mm metrology and inspection: The current state and the road ahead
【24h】

450mm metrology and inspection: The current state and the road ahead

机译:450mm计量和检查:当前状态和前方的道路

获取原文

摘要

450mm metrology is off to a great start. Early test wafer tools have provided all the basic characterization techniques needed for ETW pilot line demonstration, but, recent changes to 450mm HVM insertion strategy have presented new challenges. This paper provides an update to the current state of 450mm metrology, highlights some of the challenges the 450mm transition has presented, discusses some proposed new or modified standards for 450mm, and outlines future work planned by G450C and its collaboration partners.
机译:450mm Metrology offe off开始。早期的测试晶片工具提供了ETW试点线示范所需的所有基本表征技术,但最近改变了450mm HVM插入策略的变化呈现出新的挑战。本文提供了对450mm的最新状态的更新,突出了450mm过渡所提出的一些挑战,讨论了450毫米的一些新的或修改的标准,并概述了G450C和其协作合作伙伴计划的未来工作。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号