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Case studies of fault isolation for the global failing patterns on SRAM bitmap caused by the defects in peripheral logic regions

机译:外围逻辑区域缺陷引起的SRAM位图对全球失败模式的故障隔离案例研究

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Product-like functional SRAM test chips have been widely used to capture systematic yield loss mechanisms during yield learning. Especially in early technology development, the top failing modes contributing to bit loss count are global patterns in the SRAM bitmap, which are highly suspected to be caused by defects in the peripheral control circuits. This paper describes a fault isolation flow on for global patterns which combines bitmap analysis, SRAM functional test debugging, circuit layout tracing analysis and physical failure analysis.
机译:产品样功能SRAM测试芯片已广泛用于在产量学习期间捕获系统屈服损失机制。特别是在早期技术的开发中,有助于比特损失计数的顶部失败模式是SRAM位图中的全局模式,这是由外围控制电路中的缺陷引起的高度怀疑。本文介绍了用于全局模式的故障隔离流,其结合位图分析,SRAM功能测试调试,电路布局跟踪分析和物理故障分析。

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