Reliability study of solder interface with voids using an irreversible cohesive zone model

摘要

This paper directs at predicting the fatigue crack path and damage evolution process of solder interface based on an irreversible cohesive zone model. A DCB model with interfacial voids was carried out to investigate the influence of void location on crack propagation and fatigue life. Besides, the effect of different void content was also taken into consideration. Results obtained show that voids can significantly influence both propagation of damage in the interfaces and fatigue life of the whole model.