首页> 外文会议>International Conference on Electronic Packaging Technology >The Study on Cracking Reasons of LED Encapsulation Silicone
【24h】

The Study on Cracking Reasons of LED Encapsulation Silicone

机译:LED封装硅胶裂解原因的研究

获取原文

摘要

Light emitting diodes (LEDs) are increasingly widely used as a new generation of environmentally friendly green light source. However, during the use of LED especially white LED, due to the action of light, heat, etc., the failure phenomenon of cracking of the LED encapsulation adhesive is likely to occur, which will adversely affect the light efficiency and color temperature of LED and even dead lights. In this paper, through analyzing the cases of LED encapsulation adhesive cracking it is concluded that there are two main reasons for LED encapsulation adhesive cracking. One is that the LED lamp beads are affected by light and heat for a long time, which makes the encapsulation adhesive aging and hardening, leading to the cracking of the encapsulation adhesive. The other is due to the thermal mismatch between the encapsulation adhesive and the plastic part of lead frame, which causes the encapsulation adhesive to crack during the process of thermal expansion.
机译:发光二极管(LED)越来越广泛地用作新一代环保绿光源。但是,在使用LED尤其是白色LED期间,由于光,热量等的作用,可能发生LED封装粘合剂的破裂故障现象,这将对LED的光效和色温产生不利影响甚至死了灯。在本文中,通过分析LED封装粘合剂裂缝的情况,结论是LED封装粘合剂裂纹的主要原因。一个是LED灯珠子受光和热的影响很长时间,这使得封装粘合剂老化和硬化,导致封装粘合剂的开裂。另一个是由于封装粘合剂和引线框架的塑料部分之间的热失配,这导致封装粘合剂在热膨胀过程中裂纹。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号