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The development of thin film barriers for encapsulating organic electronics

机译:用于封装有机电子产品的薄膜屏障的发展

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In this work, we investigate several approaches to the development of encapsulation of organic electronics. A combination of plasma enhanced chemical vapor deposition, atomic layer deposition, and physical vapor deposition are used to make single layer and multilayer thin films and study the impact of structure on effective water vapor transmission rates. It was found that multilayer thin films consisting of organic and inorganic layers as well as inorganic nanolaminates provided the highest performance barrier films with effective water vapor transmission rates less than 5 × 10−5 g/m2/day. Materials such as atomic layer deposition deposited Al2O3 also showed excellent initial performance, but were found to be susceptible to corrosion from water. Combining alumina with other materials was found to improve the long-term performance of the alumina films. Integration of these films into organic solar cell platforms was shown to effectively maintain shelf lifetime performance for more than 7000 h.
机译:在这项工作中,我们研究了几种开发有机电子封装的方法。结合等离子体增强化学气相沉积,原子层沉积和物理气相沉积的方法来制作单层和多层薄膜,并研究结构对有效水蒸气透过率的影响。发现由有机和无机层以及无机纳米层压材料组成的多层薄膜提供了性能最高的阻隔膜,其有效水蒸气透过率小于5×10 −5 g / m 2 /天。原子层沉积沉积Al 2 O 3 之类的材料也显示出优异的初始性能,但被发现易受水腐蚀。发现将氧化铝与其他材料组合可以改善氧化铝膜的长期性能。已证明将这些薄膜集成到有机太阳能电池平台中可以有效地保持超过7000小时的保质期性能。

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