NiPdGold Plating Qualification of QFN RF-IC Packages

摘要

Quad Flat No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper lead frames. These leadless components provide an advanced packaging solution that reduces board real estate, with improved electrical and thermal performance over traditional leaded packages. The paper summarizes the qualification of NiPdGold finish component leads and solderability evaluations using eutectic and lead free solder. The Solderability results were also compared to conventional silver plated copper leadframe with tin plated terminations. Visual inspection, X-sectional analysis, SEM/EDX , Solderability tests , bond pull and reliability test results for thermal shock and temp./humidity tests including continuous improvement efforts at subcontract locations.