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Post-silicon validation challenges: How EDA and academia can help

机译:硅验证后的挑战:EDA和学术界如何提供帮助

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The challenges of post-silicon validation are continuously increasing, driven by higher levels of integration, increased circuit complexity, and platform performance requirements. The pressure of maintaining aggressive launch schedules and containing an increased cost of validation and debug, require a holistic approach to the entire design and validation process. Post-silicon validation is very diverse, and the work starts well before first silicon is available-for example, emulation, design-for-validation (DFV) features, specialized content development, etc. This will require enhancing pre-tape out validation to have healthier first silicon, developing more standard interfaces to our validation hooks, developing more predictive tools for circuit and platform simulation and post-silicon debug, adding more formal coverage methods, and improving survivability to mitigate in-the-field issues. We view the Electronic Design Automation (EDA) industry as a key enabler to help us bridge the gaps between pre-silicon and post-silicon validation, and extend the considerable intellectual wealth in pre-silicon tools to the post-silicon validation area.
机译:硅集成后验证的挑战不断增加,这是由更高级别的集成,不断增加的电路复杂性以及平台性能要求所驱动的。维护积极的启动计划并包含增加的验证和调试成本的压力要求在整个设计和验证过程中采用整体方法。芯片后验证非常多样,并且工作早在第一个芯片可用之前就可以开始进行,例如,仿真,验证设计(DFV)功能,专门的内容开发等。这将需要加强磁带预验证,以便拥有更健康的第一代硅片,为我们的验证挂钩开发更多标准接口,为电路和平台仿真以及硅片后调试开发更多的预测工具,添加更多的正式覆盖方法,并提高生存能力以缓解现场问题。我们认为电子设计自动化(EDA)行业是关键的推动力,可以帮助我们弥合硅前和硅后验证之间的差距,并将硅前工具中的大量知识财富扩展到硅后验证领域。

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