Conductive adhesives have been used for many applications as alternatives for tin lead solder and for many applications where solders are not desirable. Often passive devices are the most critical components related to long-term reliability for harsh environment electronics. This study investigates the impact of the termination of these components on long-term reliability of electrically conductive materials. The study considers six termination options on three different component body sizes. Two conductive adhesive materials are studied using a gold plated laminate circuit board. Contact resistance and component shear strength are measured under thermal cycling conditions from -40°C to +150°C. This test investigated these material conditions over the course of 2000 thermal cycles.
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