A 1.15μW 5.54mm3 Implant with a Bidirectional Neural Sensor and Stimulator SoC utilizing Bi-Phasic Quasi-static Brain Communication achieving 6kbps-10Mbps Uplink with Compressive Sensing and RO-PUF based Collision Avoidance

摘要

To solve the challenge of powering and communication in a brain implant with low end-end energy loss, we present Bi-Phasic Quasi-static Brain Communication (BP-QBC), achieving < 60dB worst-case channel loss, and ~41X lower power w.r.t. traditional Galvanic body channel communication (G-BCC) at a carrier frequency of 1MHz (~6X lower power than G-BCC at 10MHz) by blocking DC current paths through the brain tissue. An additional 16X improvement in net energy-efficiency (pJ/b) is achieved through compressive sensing (CS), allowing a scalable (6kbps-10Mbps) duty-cycled uplink (UL) from the implant to an external wearable, while reducing the active power consumption to 0.52μW at 10Mbps, i.e. within the range of harvested body-coupled power in the downlink (DL), with externally applied electric currents < 1/5th of ICNIRP safety limits. BP-QBC eliminates the need for sub-cranial interrogators, utilizing quasi-static electrical signals for end-to-end BCC, avoiding transduction losses.