On-Chip Bondwire Inductor with Ferrite-Epoxy Coating: A Cost-Effective Approach to Realize Power Systems on Chip

摘要

A novel concept of on-chip bondwire inductors with ferrite epoxy coating is proposed to provide a cost effective approach realizing power systems on chip (SOC). A Q factor of 30-40 is experimentally demonstrated which represents an improvement by a factor of 3-30 over the state-of-the-art MEMS micromachined inductors. More importantly, the bondwire inductors can be easily integrated into power SOC manufacturing processes with minimal changes, and open enormous possibilities for realizing cost-effective, high current, high efficiency power SOC''s.