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Advances in high kappa gate dielectrics for Si and III-V semiconductors

机译:用于Si和III-V半导体的高kappa栅极电介质的研究进展

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Nanoscale device technology is driving intense study of thin dielectric layers on semiconductors. The aggressive scaling of Si CMOS technology calls for identifying high /spl kappa/ dielectrics to replace SiO/sub 2/ and oxynitrides in gate related applications. The material, requirements for the alternative gate dielectric are very challenging in order to achieve performance comparable to SiO/sub 2/. Furthermore, there are demanding issues for process integration compatibility. Among several binary oxides proposed the rare earth oxides are attractive candidates based on thermodynamic energy considerations and a high conduction band offset over 2eV. The interest in the rare earth oxide stems from our earlier work on GaAs passivation. The Ga/sub 2-x/Gd/sub x/O/sub 3/ mixed oxides (/spl kappa/ =12) and the Gd/sub 2/O/sub 3/ oxides (/spl kappa/ =14) films grown by ultrahigh vacuum deposition from an oxide source formed an excellent insulating barrier with low interfacial state density D/sub it/ on the GaAs surface. This discovery has led to the first GaAs based inversion channel MOSFET devices. These dielectrics were also successfully applied to other III-V semiconductors including InGaAs, AlGaAs, InP, and GaN producing MOS diodes and MOSFETs.
机译:纳米器件技术正在推动对半导体薄介电层的深入研究。 Si CMOS技术的大规模扩展要求识别高/ spl kappa /电介质,以替代与栅极相关的应用中的SiO / sub 2 /和氧氮化物。为了获得与SiO / sub 2 /相当的性能,替代栅极电介质的材料要求非常具有挑战性。此外,对于过程集成兼容性也存在着苛刻的问题。基于热力学能量考虑和超过2eV的高导带偏移,提出的几种二元氧化物中,稀土氧化物是有吸引力的候选物。对稀土氧化物的兴趣源于我们先前在GaAs钝化方面的工作。 Ga / sub 2-x / Gd / sub x / O / sub 3 /混合氧化物(/ spl kappa / = 12)和Gd / sub 2 / O / sub 3 /氧化物(/ spl kappa / = 14)膜通过从氧化物源进行超高真空沉积而形成的生长层,在GaAs表面上形成了具有低界面态密度D / subit /的出色绝缘层。这一发现导致了首批基于GaAs的反向沟道MOSFET器件。这些电介质还成功地应用于其他III-V半导体,包括InGaAs,AlGaAs,InP和GaN生产的MOS二极管和MOSFET。

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