首页> 外文会议>Materials Science amp; Technology 2005 Conference(MSamp;T'05) vol.3; 20050925-28; Pittsburgh,PA(US) >Evolution of antiphase domain (APD)anolamellar complex structure in Ti-Al single crystals
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Evolution of antiphase domain (APD)anolamellar complex structure in Ti-Al single crystals

机译:Ti-Al单晶中反相区(APD)/ nanoamellar复合结构的演变

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We studied the growth of antiphase domain (APD) and the formation of lamellar structure during isothermal annealing of Ti-39at%Al and 40at%Al single crystals quenched from α single phase state, intending to obtain nano-scaled APD/lamellar complex structure. In the Ti-39at%Al crystal, lamellar structure with a lamellar spacing of several tens nm was not obtained by annealing at relatively low temperature such as 973 K even for 5x10~5 s since the precipitation of γ-plate was significantly slow. On the other hand, lamellar spacing of 70 nm was obtained by annealing at 1073 K only for 2x10~5 s. However, the APD size was larger than 400 nm when the lamellar spacing smaller than 100 nm was obtained. An APDanolamellar complex structure in which average APD size (l) was smaller than 200 nm and average lamellar spacing (L ) was smaller than 100 nm was obtained by annealing at intermediate temperatures of 998—1048 K. Finer APDanolamellar complex structure was obtained in the Ti-40at%Al crystal even at 973 K and 1073 K since the γ-plate precipitation was faster than in the Ti-39at%Al crystal. The finest structure in the present study with l of 125 nm and L of 25nm, in which lamellar spacing was partly smaller than 10 nm, were obtained by annealing the Ti-40at%Al crystal at 973 K for 5x10~5 s. Hardness was dependent on both of APD size and lamellar spacing, and tended to increase with decreasing APD size and decreasing lamellar spacing in the range studied. The Ti-39at%Al crystal with l of 250 nm and L of 45 nm exhibited the hardness of HV 386 on its (1120) plane. It is approximately three times higher than that of completely ordered Ti_3Al without APD or lamellar structure.
机译:我们研究了从α单相态淬火的Ti-39at%Al和40at%Al单晶的等温退火过程中反相畴(APD)的生长和层状结构的形成,旨在获得纳米级APD /层状复合结构。在Ti-39at%Al晶体中,即使在5×10〜5s内,即使在5×10〜5s内,在973K等较低温度下进行退火,也无法获得数十nm的层状间隔的层状结构。另一方面,仅在1073 K下退火2x10〜5 s可获得70 nm的层状间距。然而,当获得小于100nm的层状间隔时,APD尺寸大于400nm。通过在998-1048 K的中间温度下退火,获得平均APD尺寸(l)小于200 nm,平均片层间距(L)小于100 nm的APD / nanoamellar复合结构。即使在973 K和1073 K时,在Ti-40at%Al晶体中也能获得γ值,因为γ板的沉淀要比Ti-39at%Al晶体快。通过在973 K下对Ti-40at%Al晶体进行5x10〜5 s的退火处理,获得了本研究中具有125 nm的l和25nm的L的最佳结构,其中片层间距部分小于10 nm。硬度取决于APD尺寸和层间距,并且在所研究的范围内,硬度会随着APD尺寸的减小和层间距的减小而增加。 l为250 nm,L为45 nm的Ti-39at%Al晶体在其(1120)平面上显示出HV 386的硬度。它是没有APD或层状结构的完全有序Ti_3Al的三倍。

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