Design of Low Loss Transmission Lines on GaAs Substrates using the Surface Micromachining Methods

摘要

This paper describes a new GaAs-based micromachined microstrip line with elevated and overlaid signal line with ground metal. This new type of overlay microstrip line (OML) structure is developed using micromachining techniques to provide easy means of airbridge connection between the signal lines, as well as to achieve low losses over wide impedance ranges.