Die Edge Thin Film Delamination on the Bottom Die of a Stacked Chip Scale Package (SCSP)

摘要

The increasing demand for high end electronic devices incorporating multiple functions in a small form factor leads to the widespread use of Stacked Chip Scale Packaging (SCSP) in the semiconductor industry. Multiple die stacking in various combinations have been achieved. However, new failure mechanisms are being observed due to new package stress characteristics. This paper will present a unique failure mechanism observed on the bottom die of a multiple die stack package. A detailed discussion of the failure mechanism showing the interaction between the presence of a high die attach adhesive fillet and the die singulation damage initiating a thin film delamination from the die edge towards the active circuit area causing electrical failures will be presented.