ANALYSIS ABOUT THE THERMAL CHARACTERISTICS OF HEAT SINKS OF ELECTRONIC CHIPS

摘要

For the time being, the most useful and extensive cooling method of electronic chips is still the forced convection based methods. Few researches with regard to the heat transfer of heat sinks have focused on the standard characteristics of heat sinks, which indicate the heat removal capability of the heat sinks. This paper presents a research of the thermal characterization analysis of commercial heat sinks that work under both natural and forced convection conditions. In this research, the enhancement of heat transfer from the heat source by using single jet impingement of air was experimentally investigated. The experimental approach and experimental apparatus are quite unique.The author analyzed the steady state and the transient process of sudden jump heating and cooling. A series of measurements were carried out to evaluate the influence of the heat dissipation and the incoming flow velocity. Some plots have been drawn, based on the date. Sets of analytical solutions have been developed. Finally, the paper also studied the cooling efficiency and thermal resistance of different heat sinks.