HIGH POWER LIGHT EMITTING DIODE PACKAGE, CAPABLE OF PREVENTING THE SEPARATION OF A LIGHT EMITTING DIODE CHIP FROM A HEAT SINK BY REGULATING THERMAL EXPANSION COEFFICIENT BETWEEN THE LIGHT EMITTING DIODE CHIP AND THE HEAT SINK

摘要

PURPOSE: A high power light emitting diode(LED) package is provided to maximize light emitting effect by forming a dual reflective plate in order to effectively reflect light emitted from an LED chip.;CONSTITUTION: A contact point(11) is formed on the upper side of an insulating plate(10). A first reflecting plate(21) and a second reflecting plate(23) are formed to effectively emit light from an LED chip(30). The first reflecting plate and the second reflecting plate are separated by a flat plate(22). In the flat plane, a contact hole(22a) for electrically connecting the lead line(31) of the LED chip to the contact point of the insulating plate is formed. A heat sink is located at the bottom side of the insulating plate.;COPYRIGHT KIPO 2011