Study on Self-Alignment Capability of Electrically Conductive Adhesives (ECAs) for Flip-Chip Application

摘要

This study is focused on the feasibility study of self-alignment capability of the Electrically Conductive Adhesives (ECAs) for the application to flip-chip interconnection. The effect of the low melting point alloy (LMA) filler on the self-alignment capability of ECAs was investigated. The surface energy of the epoxy resin was studied in terms of the various additives and their loading level by using a Goniometer with a built-in environmental chamber. The curing profile of the epoxy resin and the melting point of the LMA filler were measured by using a differential scanning calorimeter (DSC). The ECAs filled with the LMA over 85 wt% showed the self-alignment during the heating process. However, when the silver flakes were added into the ECA formulation, the self-alignment did not take place. It is thought that the LMA filler depleted into the silver flakes can adversely affect the self-alignment of ECAs. The key parameters required for self-alignment capability of ECAs were presented. This paper discusses the feasibility of the application of ECA with self-alignment capability for flip-chip interconnection. Initial results from these series studies indicate that incorporation of the LMA into ECAs is an efficient way to make ECAs with self-alignment capability.