首页> 外文会议>International Conference on Defects in Semiconductors; 20050724-29; Awaji Island(JP) >Differential reflectance spectrum measurement to evaluate defects introduced by wet cleaning process
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Differential reflectance spectrum measurement to evaluate defects introduced by wet cleaning process

机译:差分反射光谱测量以评估湿法清洁工艺引入的缺陷

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摘要

By employing differential reflectance spectrum (DRS) method, which can detect the small change of surface states with high sensitivity, reflectance change of silicon surfaces induced by a wet surface cleaning process is evaluated. Equally cleaned two surfaces are clarified to have almost same reflectance in the order of 10~(-4) in DRS. However, repeat of the cleaning leads to reflectance change in the order of 10~(-3) in the case of Si(111). The shape of the spectra is similar to that of oxidized surface which contains tensile strain at the interface. A conjecture on the origin of the spectrum change is proposed that the surface strain, which is generated by the repulsion between the adjacent hydrogen termination atoms, might affect. It should be noted that the small change of the surface atomic structure induced by the wet cleaning process result in the generation of the change of optical reflectance spectrum in the scale of 10~(-3).
机译:通过采用差分反射光谱法(DRS),该方法可以以高灵敏度检测表面状态的细微变化,评估了湿表面清洁工艺引起的硅表面反射率变化。在DRS中,经过均等清洁的两个表面的反射率大约为10〜(-4)。然而,在Si(111)的情况下,重复进行清洁会导致反射率变化在10〜(-3)的数量级。光谱的形状类似于在界面处包含拉伸应变的氧化表面的形状。有人推测光谱变化的起因可能是由相邻氢终止原子之间的排斥作用所产生的表面应变可能会受到影响。应当指出的是,由湿法清洁过程引起的表面原子结构的微小变化导致产生了光学反射光谱的变化,其变化范围为10〜(-3)。

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