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首页> 外文会议>Integrated optics: devices, materials, and technologies XXI >Hybrid III-V/Silicon Photonic Integrated Circuits for High Bitrates Telecommunication Applications
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Hybrid III-V/Silicon Photonic Integrated Circuits for High Bitrates Telecommunication Applications

机译：高比特率电信应用的混合III-V /硅光子集成电路

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摘要

We report on our recent advances on integrated hybrid InP/SOI transmitters using the Silicon Photonic fabrication technology. We demonstrate the direct modulation at 10 Gbits/s of different laser configurations such as wavelength tunable lasers, Distributed FeedBack (DFB) lasers and Chirp Managed Lasers (CMLs). We will also present the design, fabrication and characterization of various hybrid InP/SOI transmitters integrating lasers (tunable or DFB) and modulators (silicon or III-V) with modulation up to 32 Gbits/s.
机译：我们报告使用硅光子制造技术的集成InP / SOI混合混合发射器的最新进展。我们演示了不同激光器配置（例如波长可调激光器，分布式反馈（DFB）激光器和线性调频管理激光器（CML））在10 Gbit / s的直接调制。我们还将介绍各种集成了激光器（可调或DFB）和调制器（硅或III-V）的InP / SOI混合发射器的设计，制造和特性，其调制速度高达32 Gbit / s。

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  • 来源
  • 会议地点 San Francisco(US)
  • 作者

    David Carrara; Alexandre Shen; Xavier Pommarede; Guillaume Levaufre; Nils Girard; Dalila Make; Genevieve Glastre; Jean Decobert; Francois Lelarge; Romain Brenot; Segolene Olivier; Christophe Jany; Stephane Malhouitre; Benoit Charbonnier; Christophe Kopp; Guang-Hua Duan;

  • 作者单位

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

    CEA LETI, Minatec, 17 rue des Martyrs, F-38054 GRENOBLE cedex 9, France;

    CEA LETI, Minatec, 17 rue des Martyrs, F-38054 GRENOBLE cedex 9, France;

    CEA LETI, Minatec, 17 rue des Martyrs, F-38054 GRENOBLE cedex 9, France;

    CEA LETI, Minatec, 17 rue des Martyrs, F-38054 GRENOBLE cedex 9, France;

    CEA LETI, Minatec, 17 rue des Martyrs, F-38054 GRENOBLE cedex 9, France;

    III-V Lab, a joint lab of Nokia', Thales ' and 'CEA', Campus Polytechnique, 1, Avenue Augustin Fresnel, 91767 Palaiseau cedex, France;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Hybrid photonic integrated circuits; silicon laser; semiconductor lasers; silicon-on-insulator (SOI) technology;

    机译：混合光子集成电路；硅激光器半导体激光器；绝缘体上硅（SOI）技术;
  • 入库时间 2022-08-26 13:49:13

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