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On the robustness of ultra-high voltage 4H-SiC IGBTs with an optimized retrograde p-well

机译:优化逆向p阱的超高压4H-SiC IGBT的耐用性

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The robustness of ultra-high voltage (>10kV) SiC IGBTs comprising of an optimized retrograde p-well is investigated. Under extensive TCAD simulations, we show that in addition to offering a robust control on threshold voltage and eliminating punch-through, the retrograde is highly effective in terms of reducing the stress on the gate oxide of ultra-high voltage SiC IGBTs. We show that a 10 kV SiC IGBT comprising of the retrograde p-well exhibits a much-reduced peak electric field in the gate oxide when compared with the counterpart comprising of a conventional p-well. Using an optimized retrograde p-well with depth as shallow as 1 µm, the peak electric field in the gate oxide of a 10kV rated SiC IGBT can be reduced to below 2 MV.cm
机译:研究了由优化的逆向p阱组成的超高压(> 10kV)SiC IGBT的鲁棒性。在广泛的TCAD模拟下,我们表明,除了提供对阈值电压的鲁棒控制并消除穿通之外,逆行在降低超高压SiC IGBT栅极氧化物上的应力方面非常有效。我们显示,与包括传统p阱的对端相比,由反向p阱组成的10 kV SiC IGBT在栅极氧化物中表现出大大降低的峰值电场。使用深度仅为1 µm的优化的逆向p阱,可以将10kV级SiC IGBT的栅极氧化物中的峰值电场降低到2 MV.cm以下

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