School of Mechanical Engineering and Automation, Beihang University, Beijing, 100191, China;
School of Mechanical Engineering and Automation, Beihang University, Beijing, 100191, China;
School of Mechanical Engineering and Automation, Beihang University, Beijing, 100191, China;
School of Mechanical Engineering and Automation, Beihang University, Beijing, 100191, China;
Solder joint; Adhesive type; Equivalent Stress; Random vibration; Finite element method;
机译:在不同温度下承受随机振动载荷的焊点失效研究
机译:SAC305和Sn37Pb焊锡合金的谐波振动和随机振动耐久性
机译:使用温度循环,随机振动以及温度循环和随机振动组合测试研究Sn37Pb PBGA焊点的失效
机译:用粘合剂填充对随机振动的焊料合金的影响
机译:随机振动经受的结构的故障预测
机译:超声振动对硅烷偶联剂接枝CFRP /铝合金接头粘接性能的影响
机译:Pb40 / Sn60近共晶焊料合金的振动力学