Development of Novel Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials with High Elongation

摘要

Novel Low-temperature curable positive-tone photosensitive polyimides (posi-PSPIs) with high elongationhave been developed as dielectric layers for copperredistribution layers (RDLs). The posi-PSPIs show lowtemperature curable nature, strong adhesion to the copper RDLs and high chemical resistance for establishing multi RDLs by incorporating polyimides with cross-linkers and adhesion promoters. Also, posi-PSPIs are able to achieve the high elongation property by improving the base-polyimides, therefore, the posi-PSPIs' high reliability in packages have been demonstrated as the next generation materials for RDLs.