首页> 外文会议>Conference on Microlithographic Techniques in Integrated Circuit Fabrication II, Nov 28-30, 2000, Singapore >200/300 mm Micrascan IV 248nm System for High Throughput Tight CD Control Applications
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200/300 mm Micrascan IV 248nm System for High Throughput Tight CD Control Applications

机译:200/300 mm Micrascan IV 248nm系统,用于高通量和紧密CD控制应用

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摘要

Micrascan (MS) IV is designed to provide superior Critical Dimension (CD) control & overlay performance at very high wafer throughputs for both 200 and 300mm wafers at low cost of ownership. This new system, targeted for sub-critical applications, includes SVGL's new flexible cross-performance platform & improved 0.6NA Catadioptric Projection Optics for better resolution and overlay. A new Laser Illumination System (LIS), capable of high doses at high throughput, uses a 2 kHz semi line narrowed KrF laser. SVGL has demonstrated its MS IV 248nm DUV optical design for successful insertion at the 180nm Lithography node. In this paper, modeled capabilities of SVGL's DUV optical design for both group and isolated lines will be presented. The performance potential with both conventional and enhanced illumination will be considered. Data from SVGL's Micrascan systems, illustrating Linewidth control, Depth Of Focus (DOF) performance for 180nm Group & Isolated features, and overlay performance potential will be given. The Cross performance platform with its high throughput capabilities will be discussed.
机译:Micrascan(MS)IV旨在以极低的拥有成本为200和300mm晶圆提供极高的临界尺寸(CD)控制和覆盖性能,同时具有很高的晶圆产量。这个针对亚临界应用的新系统包括SVGL的新型灵活跨性能平台和经过改进的0.6NA折反射投影光学元件,可提供更好的分辨率和覆盖度。一种新的激光照明系统(LIS)使用2 kHz半线窄KrF激光器,能够以高通量实现高剂量。 SVGL展示了其MS IV 248nm DUV光学设计,可成功插入180nm光刻节点。在本文中,将介绍SVGL的DUV光学设计针对组线和隔离线的建模能力。将考虑常规照明和增强照明的性能潜力。将提供来自SVGL Micrascan系统的数据,这些数据将说明线宽控制,180nm分组和隔离功能的景深(DOF)性能以及重叠性能潜力。将讨论具有高吞吐量功能的Cross性能平台。

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