Collective flip-chip technology for hybrid focal plane arrays

摘要

After a description of the flip-chip technique developed at LETI, we present its main advantages and its evolution. Using this basic method, a mass production procedure has been developed in order to decrease the cost of the technological step. With this new method, we are able to simultaneously hybridize several linear or two dimensional arrays directly onto readout circuits on Φ 150 mm silicon wafer. The electrical accessibility to the components provided by the method enables more detailed electrical tests to be carried out with an automatic prober before manual integration in cryogenic conditions which is done only for good electrical devices. We have also developed a high reliability method in order to hybridize very large IRFPA. With this improved technique, 2D arrays can undergo several thousand 300 K ― 77 K cycles without degradation.