Flip-Chip Bonding Equipment for UV Focal Plane Array Development Based on GaN/AlGaN p-i-n Photodiodes.

摘要

This instrumentation proposal is for flip-chip bonding equipment that is essential for bonding the large-format arrays that have been proposed to Si readout integrated circuits (ROICs). At present, no flip-chip bonding equipment is currently available at NCSU, and the flip-chip bonder at NVL is limited in its bonding force such that only diode arrays of up to 64 x 64 pixels can be bonded using indium bump bonds. The proposed flip-chip bonder is designed to bond diode arrays of up 256 x 320 pixels or greater to associated silicon ROICs. In addition, the use of other bonding metals such as lead-alloys commonly used in silicon flip-chip circuitry can be investigated. The use of these alloys in place of indium will permit operation of these new UV imagers at higher temperatures. This will permit use of this new type of UV camera in a variety of Army battlefield environments.