MR Monitoring of CMP Slurries and Post-CMP Cleaning Solutions

摘要

We have shown that Near Infrared Technique is a non-contact analytical method with very wide application range to monitor both solids and dissolved components of CMP slurries and post CMP cleaning solutions. The accuracy of the monitoring is limited by the accuracy of calibration / reference method and the noise and drift level of the instrument. Since many NIR instruments on the market have multi-cjannel capabilities, and can be utilized with fiberoptic probes that can be tens of meters long, method offers almost limitless capabilities for on-line monitoring of CMP and post-CMP processes. Another advantage pointed out is that spectra can be directly correlated to additional process variables, such as defect rate, etch-rate, cleanliness, etc..