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Control of PS-b-PMMA directed self-assembly registration by laser induced millisecond thermal annealing

机译:激光诱导毫秒热退火控制PS-b-PMMA定向自组装配准

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Directed self-assembly of PS-b-PMMA during laser spike annealing at peak temperatures of 300-800℃ for dwells of 1-10 ms has been explored. The enhanced mobility of polymer chains at these temperatures improves registration compared to conventional thermal anneals. PS-b-PMMA films (forming 15 nm line/space standing lamellae) were cast on chemically patterned substrates with a copolymer neutral layer and annealed by laser and hot-plate (2 minutes 250℃). Annealing by hot plate or multiple laser scans resulted in well-aligned features over micron length scales. By laser annealing multiple times, defectivity can be reduced by -60%. However, laser annealing for only 10 ms before performing a hot plate anneal reduced defectivity by -80%. Additionally, defects are more often localized as dislocation pairs rather than regions perpendicular to the underlying directing pattern resulting in far greater total alignment.
机译:研究了PS-b-PMMA在300-800℃峰值温度下激光停留时间为1-10 ms的激光尖峰退火过程中的定向自组装。与常规热退火相比,在这些温度下聚合物链迁移率的提高改善了配准。将PS-b-PMMA薄膜(形成15 nm的线/空位薄片)浇铸在具有共聚物中性层的化学图案化基材上,并通过激光和热板退火(250℃2分钟)。通过热板退火或多次激光扫描产生的微米尺度范围内的特征对齐良好。通过多次激光退火,缺陷率可降低-60%。但是,在进行热板退火之前,仅进行10毫秒的激光退火可以将缺陷率降低-80%。另外,缺陷更多地被定位为位错对,而不是垂直于下面的引导图案的区域,从而导致更大的总对准。

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