Modeling and Simulation of Electrothermomechanical Coupling Phenomena in High Power Electronics

摘要

High power electronic devices based on innovative semiconductor technology play a significant role in technical applications. A robust operating behavior of such devices can be achieved by an optimal design taking into account the presence of coupled physical effects. In this contribution, we focus on electrothermomechanical coupling phenomena in Integrated-High-Voltage Modules with housing and cooling mechanisms that are used as electric drives for high power electromotors. For the numerical solution of the underlying coupled systems of partial differential equations we consider efficient algorithmic tools such as domain decomposition techniques.