首页> 外文会议>33rd European Solid-State Device Research Conference (ESSDERC 2003); Sep 16-18, 2003; Estoril, Portugal >Coherent Interconnect/Substrate Modeling Using SPACE - An Experimental Study
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Coherent Interconnect/Substrate Modeling Using SPACE - An Experimental Study

机译:使用SPACE的相干互连/基板建模-实验研究

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The functionality of modern IC's increasingly suffers from substrate noise. Digital transistors switching at high frequencies are known to induce substrate noise through their bulk contacts. In addition, interconnect carrying aggressive, high-frequency signals is known to induce substrate noise through its capacitive coupling with the substrate. In this paper, we describe how our layout-to-eircuit extractor SPACE builds a coherent interconnect/substrate model from a layout. The result is a comprehensive circuit model which can immediately be simulated by a regular circuit simulator. We evaluate our modeling approach by extracting a ring-oscillator layout and simulating the resulting circuit with HSPICE. We have done extractions under varying conditions; the simulation results give practical insight into relevant substrate noise phenomena.
机译:现代IC的功能越来越多地遭受基板噪声的困扰。已知以高频率开关的数字晶体管会通过其体接触引起基板噪声。另外,已知携带激进的高频信号的互连通过其与基板的电容性耦合来诱发基板噪声。在本文中,我们描述了布局到电路的提取器SPACE如何从布局构建相干的互连/衬底模型。结果是一个全面的电路模型,可以立即通过常规电路模拟器进行仿真。我们通过提取环形振荡器的布局并用HSPICE仿真电路来评估我们的建模方法。我们在不同的条件下进行了提取;仿真结果为相关的基板噪声现象提供了实用的见识。

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