Facile, Packaging Substrate-Agnostic, Microfabrication and Assembly of Scalable 3D Metal Microelectrode Arrays for in Vitro Organ-on-a-Chip and Cellular Disease Modeling

摘要

We present a novel, packaging substrate-agnostic, microfabrication and assembly technology for the rapid development of 3D metal Microelectrode Arrays (MEAs) for in vitro organ-on-a-chip and cellular disease modeling assays. The microfabrication of the 3D metal MEAs was carried out by laser micromachining in 2D and transitioned out-of-plane to the final 3D conformation by a custom fabricated Hypodermic Needle Array (Hypo-Rig). The 3D metal MEAs were packaged on multiple substrates, and a 3D insulation layer was defined to fabricate ~70µm microelectrodes that were subsequently characterized mechanically and electrically, both depicting comparable performance to conventional 3D MEAs.