China Aerospace Components Engineering Center, Beijing, 100094, People's Republic of China;
China Aerospace Components Engineering Center, Beijing, 100094, People's Republic of China;
Shandong Institute of Space Electronic Technology, Yantai, Shandong Province, 267640, People's Republic of China;
China Aerospace Components Engineering Center, Beijing, 100094, People's Republic of China;
Wires; Electric shock; Vibrations; Bonding; Gold; Strain;
机译:Au和Cu引线键合到Al,Ni / Au和Ni / Pd / Au封盖的Cu焊盘的机械可靠性
机译:通过使用激光和分析模型同时监视振动幅度和键合摩擦,从而改进了对超声波引线键合过程的监视
机译:引线键合毛细管的超声振动研究
机译:机械冲击下Au键合线振动幅度的研究
机译:100万金丝键合在不同焊盘开口形状,尺寸和放置精度下的机械可靠性。
机译:粘合参数对Ag-10au-3.6PD合金键合线自由空气性能和粘结强度的影响
机译:Si(553)轴表面上的摇摆粘合线的振动驱动自掺杂