Tn) of the '/> Physical Mechanism Underlying the Time Exponent Shift in the Ultra-fast NBTI of High-k/Metal gated p-CMOSFETs
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Physical Mechanism Underlying the Time Exponent Shift in the Ultra-fast NBTI of High-k/Metal gated p-CMOSFETs

机译:高k /金属栅p-CMOSFET超快NBTI中时间指数漂移背后的物理机制

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摘要

In this study, ultra-fast methods were used to measure the threshold voltage shift (ΔVnTn) of the negative bias temperature instability (NBTI) in p-channel complementary metal oxide semiconductor field effect transistors (p-CMOSFETs) with a high-klmetal gate (HK/MG) stack. The voltage (Vg,str) and temperature (T) dependence of the NBTI time exponent (n) were studied under a wide range of stress conditions, and the results demonstrated a strong T dependence of n above room temperature (RT) and that the field reduction effect played an important role in determining the dependence of n on Vg,str and T. With the direct current current-voltage (DCIV) method, the similarity of n, activation energy (EA) and voltage acceleration factor (Γ) between the trap generation (ΔNnTn) and ΔVnTnindicates that ΔNnTnis the dominant subcomponent at higher values of T. The impact of the field reduction effect on the time exponents of ΔVnTnand ΔVnTn, EnAn, and Γ were also investigated.
机译:在这项研究中,超快速方法用于测量阈值电压偏移(ΔVnTn)具有高k金属栅极的p沟道互补金属氧化物半导体场效应晶体管(p-CMOSFET)的负偏置温度不稳定性(NBTI)( HK / MG)堆栈。在广泛的应力条件下研究了NBTI时间指数(n)的电压(Vg,str)和温度(T)依赖性,结果表明在高于室温(RT)的情况下,n对T的依赖性很强。场减小效应在确定n对Vg,str和T的依赖性方面起着重要作用。使用直流电流-电压(DCIV)方法,n之间的相似性,活化能(EA)和电压加速因子(Γ)陷阱生成(ΔNn T < / sub> n)和ΔVn T 表示ΔNn T 在较高的T值处成为主要子分量。场减小效应对ΔVn T nandΔVn T n,En A n和Γ。

著录项

  • 来源
  • 会议地点 Singapore(SG)
  • 作者单位

    University of Chinese Academy of Sciences, Beijing, 100049, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China;

    University of Chinese Academy of Sciences, Beijing, 100049, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China;

    IMEC, Kapeldreef 75, 3001, Leuven, Belgium;

    University of Chinese Academy of Sciences, Beijing, 100049, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China;

    University of Chinese Academy of Sciences, Beijing, 100049, China;

    University of Chinese Academy of Sciences, Beijing, 100049, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Stress; Negative bias temperature instability; Thermal variables control; Time measurement; Stress measurement; Logic gates; Temperature measurement;

    机译:应力;负偏压温度不稳定性;热变量控制;时间测量;应力测量;逻辑门;温度测量;;

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