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Evaluating the impact of spike and flicker noise in phase change memories

机译:评估相变存储器中尖峰和闪烁噪声的影响

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This paper presents a simulation-based analysis of spike and flicker noise in a Phase Change Memory (PCM); this investigation is based on HSPICE simulation by taking into account cell-level (with its neighbors) and array-level considerations. State switching phenomena in binary PCM memories are dealt in detail to assess the impact of these two types of noise. It is shown that a lower feature size is of concern for flicker noise in terms of value and percentage variation (while not substantially affecting array-level performance). This paper also shows that spike noise has a radically different behavior: spike noise shows a dependency on the PCM resistance more than the type of state of the PCM. It increases substantially when the amorphous resistance increases and has a nearly constant value when the memory cell is changing to an amorphous state.
机译:本文介绍了基于模拟的相变存储器(PCM)中的尖峰和闪烁噪声分析;这项研究基于HSPICE模拟,并考虑了单元级别(及其邻居)和阵列级别的考虑。详细介绍了二进制PCM存储器中的状态切换现象,以评估这两种类型的噪声的影响。结果表明,就值和百分比变化而言,较低的特征尺寸对于闪烁噪声是值得关注的(虽然基本上不会影响阵列级性能)。本文还表明,尖峰噪声的行为完全不同:尖峰噪声对PCM电阻的依赖性大于对PCM状态类型的依赖性。当非晶电阻增加时,它实质上增加,而当存储单元变为非晶状态时,它具有几乎恒定的值。

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