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Arsenic atomic layer doping in Si using AsH3

机译:用AsH 3 掺杂Si中的砷原子层

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摘要

As dose as function of AsH3 exposure temperature is shown in Fig. 1. Temperature change after Si buffer deposition and AsH3 exposure are done in H2 or N2. For both cases the As incorporation is suppressed below 400°C. The incorporation behaviour is different from PH3 [3]. A possible explanation could be that limited hydrogen desorption from AsH3 molecule gas at lower temperature causes prevention of As adsorption. In the case of the sample of temperature change in H2, there is no or a very weak temperature dependence of the As dose at temperatures between 450°C to 700°C. By changing temperature in N2, slight increase of As dose is observed with increasing AsH3 exposure temperature from 450°C to 700°C.
机译:作为剂量作为AsH3暴露温度的函数,如图1所示。Si缓冲沉积和AsH3暴露后的温度变化在H2或N2中进行。在这两种情况下,As的掺入均在400°C以下被抑制。结合行为不同于PH3 [3]。可能的解释是,较低温度下AsH3分子气体中有限的氢解吸会阻止As的吸附。对于H2中的温度变化样品,在450°C至700°C之间的温度下,砷剂量对温度的依赖性不大或非常弱。通过改变N2中的温度,观察到As剂量随AsH3暴露温度从450°C升高到700°C略有增加。

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