Design and implementation of ultra-thin SiP modules

摘要

In recent years, SiP (System-in-Package) or SOP (System on Package) technology has become an attractive solution for size reduction of mobile devices. Passive components such as inductors or capacitors can be integrated into the substrate. The dimension of embedded capacitors can be further reduced by using high dielectric constant material. Thus, size miniaturization and cost reduction can be easily achieved through the replacements of surface-mounted devices (SMDs) on the substrate.