Next generation electroplating technology for high planarity, minimum surface deposition microvia filling

机译：下一代电镀技术可实现高平面度，最小的表面沉积微孔填充

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摘要

The combination of specialized equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling.

机译：专用设备和新型铜通孔填充化学技术的结合为最终用户提供了一种经济高效，功能强大且经过生产验证的IC封装衬底微孔填充工艺。

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《2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference.》|2012年|p.259-262|共4页
会议地点 Taipei(CT);Taipei(CT)
作者
Ming-Yao Yen; Ming-Hung Chiang; Hsu-Hsin Tai; Hsien-Chang Chen; Kwok-Wai Yee; Li Crystal; Lefebvre Mark; Bayes Martin;
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作者单位

Dow Electronic Materials, The Dow Chemical Company, No. 6, Lane 280, Chung Shan North Road, Ta Yuan Industrial Zone, Ta Yung Hsiang, Taoyuan Hsien, Taiwan, R.O.C.;

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会议组织
原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;微电子学、集成电路（IC）;
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专利

1. COPPER ELECTROPLATING TECHNOLOGY FOR mICROVIA FILLING [J] . George allardyce, mark Lefebure, Hidehi Tsuchida, Circuitree . 2004,第3期

机译：微量电镀铜电镀技术
2. Copper electroplating technology for microvia filling [J] . Mark Lefebvre, George Allardyce, Masaru Seita, Circuit World . 2003,第2期

机译：微孔填充的铜电镀技术
3. Improving accuracy of filling performance prediction in microvia copper electroplating [J] . Moon Jeong-Ho, Shin Jaewook, Kim Tae-Hee, Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry . 2020,第1期

机译：提高微径铜电镀填充性能预测的准确性
4. Next generation electroplating technology for high planarity, minimum surface deposition microvia filling [C] . Ming-Yao Yen, Ming-Hung Chiang, Hsu-Hsin Tai, International Microsystems, Packaging, Assembly and Circuits Technology Conference . 2012

机译：下一代电镀技术高平面性，最小表面沉积微液体填充
5. Deposition of cationic polymer micelles on planar and patterned silicon dioxide surfaces. [D] . Hahn, Jungseok. 2003

机译：在平面和有图案的二氧化硅表面上沉积阳离子聚合物胶束。
6. Planar Zeolite Film-Based Potentiometric Gas Sensors Manufactured by a Combined Thick-Film and Electroplating Technique [O] . Isabella Marr, Sebastian Reiß, Gunter Hagen, 2011

机译：厚膜与电镀相结合的平面沸石膜电位气体传感器
7. Publisher's Note: Microvia Filling by Cu Electroplating over a Au Seed Layer Modified by a Disulfide J. Electrochem. Soc., 156, D155 (2009) [O] . Dow W.P., Chiu Y.D., Yen M.Y. 2014

机译：出版商注：通过Cu电镀在二硫化物修饰的au种子层上进行微孔填充J. Electrochem。 soc。，156，D155（2009）
8. Optimized Deposition Parameters & Coating Properties of Cobalt Phosphorus Alloy Electroplating for Technology Insertion Risk Reduction [R] . Prado, R., Benfer, J., Facchini, D., 2010

机译：电镀钴磷合金优化沉积参数及涂层性能降低技术插入风险

Next generation electroplating technology for high planarity, minimum surface deposition microvia filling

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