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Estimation of process-induced variations in double-gate junctionless transistor

机译:双栅极无结晶体管的过程引起的变化估计

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In this paper, the impact of process induced variations on the electrical characteristics of a junctionless symmetric double-gate transistor (DGJLT) is reported for the first time. The process parameters considered here are gate length (L), thickness of silicon film (Tsi) and gate oxide thickness (Tox). The impact of these process parameters on the electrical parameters viz., ON current, threshold voltage (VT) and subthreshold slope (SS) are systematically investigated with the help of extensive device simulations and compared with conventional symmetric doublegate transistor (DGMOS). It is seen that ON current variation with silicon thickness is higher for DGJLT compared to DGMOS. Threshold voltage of DGJLT is more sensitive to silicon thickness and gate oxide thickness as compared to DGMOS. The overall SS variation is negligible in DGJLT compared to DGMOS.
机译:本文首次报道了工艺引起的变化对无结对称双栅极晶体管(DGJLT)的电气特性的影响。这里考虑的工艺参数是栅极长度(L),硅膜厚度(Tsi)和栅极氧化物厚度(Tox)。这些过程参数对电气参数的影响,包括导通电流,阈值电压(V T )和亚阈值斜率(SS),借助广泛的器件仿真系统进行了研究,并与常规对称方法进行了比较。双栅极晶体管(DGMOS)。可以看出,与DGMOS相比,DGJLT的导通电流随硅厚度的变化更大。与DGMOS相比,DGJLT的阈值电压对硅厚度和栅极氧化物厚度更敏感。与DGMOS相比,DGJLT中的整体SS变化可忽略不计。

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