Institute of Microelectronic Materials Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
Institute of Microelectronic Materials Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
Institute of Microelectronic Materials Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
Air Liquide China, Shanghai 200233, China;
Air Liquide China, Shanghai 200233, China;
Air Liquide Laboratory, Tsukuba-shi, Japan;
Air Liquide China, Shanghai 200233, China;
Institute of Microelectronic Materials Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
Institute of Microelectronic Materials Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
机译:微小01005电容器/ SAC305焊点的回流在保护氛围中
机译:SAC305复合焊点中钢筋的保留率:钢筋类型,加工和回流周期的影响
机译:回流和时效后,SAC305 / Ag / Cu和SAC0705-Bi-Ni / Ag / Cu焊点界面处金属间层结构的形成和演变
机译:回流气氛对SAC305焊点的影响
机译:SAC305焊点变形行为的晶体可塑性有限元分析。
机译:使用Sn纳米粒子增强焊膏焊接无源部件:对微观结构和关节强度的影响
机译:SAC305复合焊点中钢筋的保留率:钢筋类型,加工和回流周期的影响